Article
03 October 2019
Published
Institute of Electrical and Electronics Engineers (IEEE)
10.1109/jproc.2019.2941366
0018-9219
Engineering and Physical Sciences Research Council; European Commission
Dahiya, R., Yogeswaran, N., Liu, F., Manjakkal, L., Burdet, E., Hayward, V., & Jorntell, H. (2019). Large-Area Soft e-Skin: The Challenges Beyond Sensor Designs. Proceedings of the IEEE, 107(10), 2016-2033. https://doi.org/10.1109/jproc.2019.2941366
LecturerSchool of Computing Engineering and the Built Environment
0131 455 4782
L.Manjakkal@napier.ac.uk
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